Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12030140 | Lead-free solder alloy and method of manufacturing electronic device using the same | Young Woo Lee, Seul Gi LEE, Hui Joong KIM, Jae Yool Son, Jae Hun Song | 2024-07-09 |