Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12139592 | Resin composition comprising coated metal oxide particles, resin-attached metal foil, metal-clad laminated sheet, and capacitor element | Toshihiro Hosoi, Yoshihiro Yoneda, Hitohiko Ide, Hiromi Matsuura, Kouichi Kawaratani | 2024-11-12 |
| 11959775 | Information processing device and information processing method that enable simple calibration | Masato Kimishima, Kosei Yamashita, Toru Amano | 2024-04-16 |
| 11947119 | Display control device, display control method, and recording medium | Yasutaka Fukumoto | 2024-04-02 |
| 11935865 | Semiconductor package manufacturing method, and adhesive sheet used therein | Toshimi Nakamura | 2024-03-19 |
| 11890853 | Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshihiro Hosoi | 2024-02-06 |
| 11876070 | Semiconductor package manufacturing method | Toshimi Nakamura | 2024-01-16 |