Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12139576 | Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board | Sayaka Wakioka, Yuta Oatari, Kohei Takeda, Masami Shindo, Takashi Shinjo +2 more | 2024-11-12 |
| 11873398 | Interlayer insulating material and multilayer printed wiring board | Tatsushi Hayashi, Takashi Nishimura | 2024-01-16 |