Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12177962 | Insulating resin circuit substrate | Yoshiaki Sakaniwa | 2024-12-24 |
| 12137526 | Bonded body and insulating circuit board | Marina Sakamaki, Kenji Kubota | 2024-11-05 |
| 12133338 | Insulated circuit substrate manufacturing method | Yoshiaki Sakaniwa | 2024-10-29 |
| 12108528 | Insulating circuit board | Yoshiaki Sakaniwa | 2024-10-01 |
| 12068219 | Heat sink integrated insulating circuit board | Yoshiaki Sakaniwa | 2024-08-20 |