Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168634 | Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method | — | 2024-12-17 |
| 12125765 | Copper/ceramic joined body and insulating circuit substrate | — | 2024-10-22 |
| 12089342 | Insulated circuit board | Akira Sakurai | 2024-09-10 |
| 12037294 | Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method | — | 2024-07-16 |
| 12035468 | Bonded body, insulated circuit board with heat sink, and heat sink | — | 2024-07-09 |
| 12027434 | Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method | — | 2024-07-02 |
| 12002732 | Copper/ceramic assembly, insulated circuit board, method for producing copper/ceramic assembly, and method for producing insulated circuit board | — | 2024-06-04 |
| 11887909 | Copper/titanium/aluminum joint, insulating circuit substrate, insulating circuit substrate with heat sink, power module, LED module, and thermoelectric module | — | 2024-01-30 |
| 11881439 | Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production method | — | 2024-01-23 |