Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11905412 | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package | Takako Ejiri, Tetsuro Iwakura, Kana Uchimura, Toshiki Fujii, Yukako Omori +2 more | 2024-02-20 |