Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12133339 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Takuya Suzuki, Seiji Shika | 2024-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12133339 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | Takuya Suzuki, Seiji Shika | 2024-10-29 |