Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009332 | Semiconductor device having high yield strength intermediate plate | Taishi Sasaki | 2024-06-11 |
| 11901341 | Semiconductor package and production method thereof, and semiconductor device | Jun Fujita | 2024-02-13 |
| 11887933 | Manufacturing method of semiconductor device | Yuji Sato | 2024-01-30 |