Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876033 | Semiconductor device including resin case having groove at corner thereof | Masaru Furukawa, Takamasa Oda, Seiji Saiki | 2024-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876033 | Semiconductor device including resin case having groove at corner thereof | Masaru Furukawa, Takamasa Oda, Seiji Saiki | 2024-01-16 |