Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12169188 | Bonding layer evaluation system and bonding layer evaluation method | Kiyoka TAKAGI, Naoki Matsuda, Naoki Mori | 2024-12-17 |
| 12103244 | Joint structure and method for manufacturing joint structure | Tsukasa Katsumata, Kiyoka TAKAGI, Naoaki Fujiwara, Kosuke OKA, Kazuki Ohashi | 2024-10-01 |
| 12019049 | Bonding layer evaluation system and bonding layer evaluation method | Kiyoka TAKAGI, Naoki Matsuda, Naoki Mori | 2024-06-25 |
| 11987013 | Composite material forming method | Toshiyuki TAKAYANAGI, Naomoto Ishikawa, Wataru Nishimura, Nobuyuki Kamihara, Kiyoka TAKAGI +4 more | 2024-05-21 |