Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881516 | Semiconductor element comprising a MIM capacitor and a via hole, a bottom of the via hole being placed between a rear surface of a source electrode and a rear surface of a barrier metal layer | Kohei Miki, Kohei Nishiguchi | 2024-01-23 |