Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068217 | Frame member with a porous material between a semiconductor module and heat sink | Takashi Nishimura | 2024-08-20 |
| 11972991 | Semiconductor device | Tetsuo Motomiya, Kunihiko Tajiri, Jun Okada, Hiroumi Yamada, Kazutake KADOWAKI | 2024-04-30 |