Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961765 | Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrate | Shuichi HIZA, Kunihiko Nishimura, Masahiro FUJIKAWA, Yuki TAKIGUCHI | 2024-04-16 |