Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11997782 | Thermally conductive label for circuit | Kaleb A. Wilson, Bradley R. Bitz, João Elmiro da Rocha Chaves, Mark A. Tverdy | 2024-05-28 |
| 11984440 | Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods | Xiaopeng Qu | 2024-05-14 |
| 11869862 | Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems | Christopher Glancey, Koustav Sinha | 2024-01-09 |