Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132155 | Etched trenches in bond materials for die singulation, and associated systems and methods | Vladimir Odnoblyudov, Jeremy S. Frei | 2024-10-29 |
| 11901342 | Discontinuous patterned bonds for semiconductor devices and associated systems and methods | Vladimir Odnoblyudov, Jeremy S. Frei | 2024-02-13 |