Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176221 | Incorporating semiconductors on a polycrystalline diamond substrate | Edwin L. Piner | 2024-12-24 |
| 12014983 | Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one another | Radhakrishna Kotti, David A. Kewley, Dave Pratt | 2024-06-18 |
| 11990370 | Methods for forming conductive vias, and associated devices and systems | Trupti D. Gawai, David S. Pratt, Ahmed M. Elsied, David A. Kewley, Dale W. Collins +2 more | 2024-05-21 |
| 11978527 | Conductive interconnects and methods of forming conductive interconnects | David A. Kewley, Dave Pratt, Yung-Ta Sung, Frank Speetjens, Gurpreet Lugani | 2024-05-07 |