Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087716 | Techniques for positioning bond pads of microelectronic devices and related microelectronic devices, methods, and systems | Saaya Izumi, Tomohiro Kitano | 2024-09-10 |
| 12040012 | Semiconductor device having buffer circuit | Yuki Miura | 2024-07-16 |