JM

Jack E. Murray

📍 Boise, ID: #349 of 684 inventorsTop 55%
🗺 Idaho: #527 of 1,264 inventorsTop 45%
Overall (2024): #427,345 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12033929 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2024-07-09