Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887864 | Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals | Rangsun Kitnarong, Ekgachai Kenganantanon, Pattarapon Poolsup, Watcharapong Nokde, Chanyuth Junjuewong | 2024-01-30 |