Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11952264 | Electronic device | Jia Yin Wu, Yueh-Kang Lee | 2024-04-09 |
| 11858187 | Mold apparatus including mold sensor cooling structure | Shia-Chung Chen, Yan Liang, Yu-Hung Ting | 2024-01-02 |