Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11896830 | Sealed package and method of forming same | Rajesh V. Iyer, Gordon O. Munns, Christian S. Nielsen, Andrew J. Ries | 2024-02-13 |
| 11890484 | Implantable medical devices having modular lead bores | Darren A. Janzig, Brad C. Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead | 2024-02-06 |
| 11872392 | Diffusion bonded lead connector | Darren A. Janzig, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner | 2024-01-16 |
| 11872405 | Feedthrough assembly | Brad C. Tischendorf | 2024-01-16 |