Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12139622 | Hollow resin particles for thermosensitive recording media | Koichi SAKABE | 2024-11-12 |
| 11980863 | Heat-expandable microspheres and application thereof | Nobuaki Fujii, Sachiko Tokumura | 2024-05-14 |