Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074099 | Microelectronics package assemblies and processes for making | Christopher W. Johnson, ZhenWei Tee, Noel De Leon, SinLi Tan | 2024-08-27 |
| 12020999 | Cover lid with selective and edge metallization and methods of making | — | 2024-06-25 |