Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166486 | Managing signal transfers in semiconductor devices | Wei-Yi Cheng | 2024-12-10 |
| 11984371 | Testing bonding pads for chiplet systems | Chun-Hsiung Hung | 2024-05-14 |
| 11894100 | Data serializer, latch data device using the same and controlling method thereof | Yi-Fan Chang | 2024-02-06 |
| 11887949 | Bond pad layout including floating conductive sections | Jian-Syu Lin, Yi-Fan Chang | 2024-01-30 |