Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119156 | Inductor thermal management system | Gargi Kailkhura, Mark Daniel Goldman, Bozhi Yang, Christopher McCarthy, Peter H. J. How +1 more | 2024-10-15 |
| 12033908 | Transistor package comprising thermally conductive and electrically insulating layer | Bozhi Yang | 2024-07-09 |
| 11997812 | Cover for sealing a power module | Kevin Richard Fine, Peter H. J. How, Steven Nicholas Grolle, Stephen Robert Bannick | 2024-05-28 |
| 11991869 | Thermal management system including an overmolded layer and a conductive layer over a circuit board | Steven Nicholas Grolle, Gargi Kailkhura, Peter H. J. How, Andrew Diao, Stephen Robert Bannick | 2024-05-21 |
| 11978987 | Antenna pass through module | Steven Nicholas Grolle, Peter H. J. How, Stephen Robert Bannick, Andrew Diao, Mark Daniel Goldman | 2024-05-07 |
| 11968793 | Insulating enclosure with a conductive liner | Stephen Robert Bannick, Peter H. J. How, Christopher Breckenridge Todd, Mark Daniel Goldman | 2024-04-23 |
| 11889662 | Thermal interface sandwich | Bozhi Yang | 2024-01-30 |