Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166331 | Optical device including a substrate with a conductor-filled trench on a conductive core | Wei Shi, Lijun ZHU, Raman Srinivasan, Huanlin ZHU | 2024-12-10 |
| 12040592 | Packaging substrate with low thermal resistance and low parasitic inductance | Wei Shi, Hao Huang, Huanlin ZHU, Lijun ZHU | 2024-07-16 |