Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040284 | 3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna | Hong Shen | 2024-07-16 |
| 12021041 | Region shielding within a package of a microelectronic device | Hong Shen | 2024-06-25 |
| 11929337 | 3D-interconnect | Chok J. Chia, Qwai H. Low | 2024-03-12 |