Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091567 | Ink composition, method for forming a conductive member, and conductive device | Zhenggang Li, Yeng Ming Lam, Chee Lip Gan, Jaewon Kim | 2024-09-17 |
| 12016118 | Ceramic-based circuit board assemblies formed using metal nanoparticles | Khanh Nguyen | 2024-06-18 |
| 11910520 | Thermal management in circuit board assemblies | — | 2024-02-20 |