Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12008202 | Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof | Yi-Wen Chen, I-Hsin Tung | 2024-06-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12008202 | Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof | Yi-Wen Chen, I-Hsin Tung | 2024-06-11 |