Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12180357 | ABS-based resin composition, method of preparing the same, and molded article including the same | Jinoh Nam, Seong Lyong Kim | 2024-12-31 |
| 12119329 | Semiconductor package and method of fabricating the same | Eunkyul Oh, Yunrae Cho, Taeheon Kim | 2024-10-15 |