Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040434 | Diode package structure and manufacturing method thereof | Yu-Jing FANG, Cheng-Ping Chang | 2024-07-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040434 | Diode package structure and manufacturing method thereof | Yu-Jing FANG, Cheng-Ping Chang | 2024-07-16 |