Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142532 | Interconnect structures for semiconductor devices and methods of manufacturing the same | Yu-Lien Huang, Ching-Feng Fu, Huan-Just Lin | 2024-11-12 |
| 12094768 | Method for sealing a seam, semiconductor structure, and method for manufacturing the same | Yu-Lien Huang, Ching-Feng Fu, Huan-Just Lin | 2024-09-17 |