TA

Takateru Adachi

LP Lenovo (Singapore) Pte.: 1 patents #118 of 223Top 55%
Overall (2024): #252,550 of 561,600Top 45%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12002733 Heat dissipation structure, manufacturing method for heat dissipation structure, and electronic apparatus Masahiro Kitamura, Takuroh Kamimura, Junki Hashiba 2024-06-04