MS

Masanori Shindo

LC Lapis Semiconductor Co.: 1 patents #2 of 36Top 6%
Overall (2024): #351,511 of 561,600Top 65%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12094824 Semiconductor package and method for manufacturing semiconductor package — 2024-09-17