Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12012667 | Copper electrofill on non-copper liner layers | Jonathan D. Reid, Yi Liu | 2024-06-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12012667 | Copper electrofill on non-copper liner layers | Jonathan D. Reid, Yi Liu | 2024-06-18 |