Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12173399 | Reducing line bending during metal fill process | Lei Guo, Tsung-Han Yang | 2024-12-24 |
| 12163219 | Ex situ coating of chamber components for semiconductor processing | Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more | 2024-12-10 |
| 12002679 | High step coverage tungsten deposition | Michael J. Bowes, Tsung-Han Yang, Xing Zhang | 2024-06-04 |
| 11978666 | Void free low stress fill | Tsung-Han Yang | 2024-05-07 |
| 11901227 | Feature fill with nucleation inhibition | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2024-02-13 |