Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12103114 | Lead-free solder alloy composition suitable for use in high-temperature and vibration environments and preparation method thereof | Heung Rak Sohn, Bum Gyu Baek, Jun Tae Kim | 2024-10-01 |