Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901247 | Insulating component, semiconductor package, and semiconductor apparatus | Daisuke Sakumoto | 2024-02-13 |
MJ
Masami Juta
Overall (2024): #358,742 of 561,600Top 65%
1
Patents 2024