Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183711 | Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece | Basil Milton, David Jeffery Li | 2024-12-31 |
| 12113043 | Methods of calibrating an ultrasonic characteristic on a wire bonding system | Jon W. Brunner, Aashish Shah, Hui Xu, Jeong Ho Yang | 2024-10-08 |
| 11935864 | Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods | Hui Xu, JeongHo Yang, Ziauddin Ahmad | 2024-03-19 |
| 11865633 | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods | Hui Xu, D. Matthew Odhner | 2024-01-09 |