Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11866623 | Conductive polymer composite for adhesion to flexible substrate and method for preparing same | Heesuk Kim, Youngpyo Ko, Sang Soo Lee, Jeong Gon Son, Jong Hyuk Park +2 more | 2024-01-09 |