Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884759 | Low-dielectric thermally curable resin composition and low dielectric material prepared therefrom | Churl Seung Lee | 2024-01-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884759 | Low-dielectric thermally curable resin composition and low dielectric material prepared therefrom | Churl Seung Lee | 2024-01-30 |