Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107009 | Method of dicing wafer forming modified layer in chucked wafer | Min Gyu Kang | 2024-10-01 |
| 11909156 | Connection structure for connecting power cable and conductor lead-out rod, and connection device for connecting power cable and conductor lead-out rod | Duk Kyu Lee, Dong Yun Oh | 2024-02-20 |