Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990389 | Semiconductor package including embedded cooling structure | Keeyoung Son, Joung-Ho Kim, Subin Kim, Shinyoung Park, Seungtaek Jeong +6 more | 2024-05-21 |
TS
Taein Shin
Overall (2024): #248,322 of 561,600Top 45%
1
Patents 2024