Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12180144 | Diamine compound, polyimide precursor and polyimide prepared by using the same, composition for forming polyimide film and polyimide film prepared by using the same, and uses thereof | Hyo Shin Kwak, Hye Ri Kim, Jin Hyung Park | 2024-12-31 |