Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12085515 | Methods and systems for selecting wafer locations to characterize cross-wafer variations based on high-throughput measurement signals | Brian C. Lin, Song Wu, Tianrong Zhan, Andrew Lagodzinski | 2024-09-10 |