Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11993740 | Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring board | Yuichi Imamura, Keisuke Oguma | 2024-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11993740 | Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring board | Yuichi Imamura, Keisuke Oguma | 2024-05-28 |