Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091508 | Polyimides for temporary bonding adhesives, methods for manufacturing of thermoplastic polyimide materials, and methods for thin wafer bonding using the same | Samuel Kyran | 2024-09-17 |
| 12054586 | System and method for manufacturing polyamic acid, and system and method for manufacturing polyimide | Tomoyuki Toyoda, Toshihisa Itoh, Kazuhiro Shimizu, Kiyoshi Yamaguchi | 2024-08-06 |