Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923287 | Method for manufacturing semiconductor device having chip stacked and molded | Takayuki TAJIMA | 2024-03-05 |
| 11862667 | Capacitor | Susumu Obata, Keiichiro Matsuo, Mitsuo Sano, Kazuhito Higuchi | 2024-01-02 |