Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170260 | Semiconductor package and method of manufacturing the same | — | 2024-12-17 |
| D1049065 | Semiconductor package | — | 2024-10-29 |
| 12027445 | System for cooling semiconductor component, method of manufacturing the same, and semiconductor package having the system | — | 2024-07-02 |
| 11908766 | Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined | — | 2024-02-20 |
| 11908824 | Semiconductor package, method of manufacturing the same and metal bridge applied to the semiconductor package | — | 2024-02-20 |