Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130096 | Heat sink, semiconductor package and semiconductor module | Hoshiaki Terao, Kouichi Hashimoto | 2024-10-29 |
| 12030122 | Method of manufacturing soft magnetic dust core | Naomichi Nakamura, Makoto Nakaseko, Takuya TAKASHITA, Mineo Muraki, Hoshiaki Terao +7 more | 2024-07-09 |